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N08L63W2A
Ball Grid Array Package
A1 BALL PAD
D
0.20±0.05
1.10±0.10
CORNER (3)
1. 0.30±0.05 DIA.
E
2. SEATING PLANE - Z
0.15
0.05
Z
Z
TOP VIEW
SIDE VIEW
SD
A1 BALL PAD
CORNER
e
SE
1. DIMENSION IS MEASURED AT THE
MAXIMUM SOLDER BALL DIAMETER.
PARALLEL TO PRIMARY Z.
2. PRIMARY DATUM Z AND SEATING
PLANE ARE DEFINED BY THE
SPHERICAL CROWNS OF THE
SOLDER BALLS.
3. A1 BALL PAD CORNER I.D. TO BE
MARKED BY INK.
K TYP
J TYP
e
BOTTOM VIEW
Dimensions (mm)
e = 0.75
BALL
D
E
MATRIX
SD
SE
J
K
TYPE
8±0.10
10±0.10
0.375
0.375
2.125
2.375
FULL
Rev. 8 | Page 9 of 10 | www.onsemi.com
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